Product Name: RF and Microwave Microelectronics Packaging
Product Features :
Product Description :
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics.It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector.It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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